Most standard AB glues can withstand a maximum continuous temperature of 194°F (90°C) and a short-term temperature of up to 392°F (200°C). For higher heat resistance, consider our epoxy resin AB glue—a two-part, high-temperature adhesive based on epoxy resin, ideal for bonding heat-resistant metals, ceramics, and other materials.

Key Features of Our Epoxy Resin AB Glue

• Temperature Rating:
• Continuous use: Up to 356°F (180°C)
• Short-term exposure: Up to 482°F (250°C)
• Applications: Bonds metal-to-metal, ceramic-to-metal, ceramic-to-ceramic, and other high-temperature components

Product Categories

Our epoxy resin AB glue includes three main types:

1. Epoxy Potting Compound: For encapsulating electronics and structural reinforcement.
2. High-Temperature Epoxy Adhesive: Engineered for prolonged exposure to extreme heat.
3. Fast-Curing Epoxy Adhesive: Cures quickly at room temperature or low heat, ideal for time-sensitive projects.

Performance Benefits

• Rapid Curing: Cures at low or room temperature with fast solidification.
• Strong Bonding: High adhesion strength, hardness, and flexibility after curing.
• Chemical Resistance: Withstands acids, alkalis, moisture, oil, and dust.
• Durability: Resistant to humid heat, atmospheric aging, and electrical stress (excellent insulation and compression properties).
• Versatility: Available in formulations rated for different temperature thresholds (e.g., 212°F/100°C, 392°F/200°C, 572°F/300°C, and extreme cases up to 1832°F/1000°C for specialized applications).

Important Notes

• Mixing Ratio & Work Time:
• The more glue mixed, the faster the reaction and curing speed (accompanied by heat release).
• Control batch size to avoid premature curing; use mixed adhesive promptly within its pot life.
• Safety Precautions:
• Wear protective gloves to avoid skin contact (rare cases of mild irritation may occur).
• If skin contact happens, wipe with alcohol and wash thoroughly with soap.